Sinopack Ceramic Packages for High Power Laser Devices
Using for metal wall - ceramic feedthrough structure, high electrical conductivity, lead can withstand high current. Heat sink for the heat conductivity material, satisfies the requirement of high power device cooling. Custom development for the users.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Sinopack Ceramic Packages Manufacturer for Wireless Communication Devices | Sinopack provides ceramic-to-metal seal packages for RF power transistors such as FETs and HEMTs. Ceramic feedthroughs with low electrical-resistan... |
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Sinopack 40Gbps TOSA / ROSA Ceramic Packages for LR4 | TOSA / ROSA Packages for QSFP+ Transceivers, Surface Mount Packages, XLMD-MSA Compliant BTF PKG Sinopack devotes to the R&D and manufacturing o... |
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Glass-Metal Hermetic Feedthroughs Packages for industrial manufacturing machinery | Sinopack provides glass hermetic feedthroughs and connectors based on its glass-to-metal sealing technology. These glass hermetic feedthroughs are ... |
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ALN / Alumina substrates for semiconductor laser diodes and photodiodes | Sinopack provides ceramic submounts for semiconductor laser diodes and photodiodes in fiber-optic communication modules. Both aluminum nitride (AlN... |
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