Sinopack Standard Ceramic Packages with Lids for Device Evaluation
Sinopack offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP), ceramic pin grid array packages (C-PGA), ceramic quad flat packages (C-QFP), ceramic quad flat J-leaded packages (C-QFJ) and ceramic quad flat non-leaded packages (C-QFN). Standard ceramic packages are useful in customer device evaluations and low volume orders, enabling customers to reduce tooling costs and design time.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Sinopack Standard Ceramic Packages with Lids for Device Evaluation | Sinopack offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP)... |
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100Gbps TOSA / ROSA Packages for CFP4 / QSFP28 Transceivers | These packages feature Ceramic-to-metal feed-thru leads for optimal function and reliability. Metal body with standard or custom heat sink material... |
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High Baud Rate Ceramic Packages for Integrated Coherent Receiver (ICR) | Sinopack manufactures 100Gbps (4x25Gbps) packages, RF Layout: GSSG x 4ch Sinopack devotes to the R&D and manufacturing of multilayer ceramic pa... |
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100Gbps Packages for Integrated Coherent Receivers (ICR) Gen 1.2 | Sinopack manufactures 100Gbps (4x25Gbps) packages, RF Layout: GSSG x 4ch with 0.8/1.0mm pitch Sinopack devotes to the R&D and manufacturing of ... |
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