TO-254 and TO-257 Ceramic Packages for Power Electronics
Sinopack provides power electronics packages by using ceramic-to-metal bonding technologies
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Sinopack Ceramic Packages Manufacturer for Wireless Communication Devices | Sinopack provides ceramic-to-metal seal packages for RF power transistors such as FETs and HEMTs. Ceramic feedthroughs with low electrical-resistan... |
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Sinopack Ceramic Packages for Uncooled Infrared Detectors | Existing packages using BTF structure, oxygen-free copper and package integration, has the characteristics of more fuses, high reliability. Maximum... |
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ALN / Alumina substrates for semiconductor laser diodes and photodiodes | Sinopack provides ceramic submounts for semiconductor laser diodes and photodiodes in fiber-optic communication modules. Both aluminum nitride (AlN... |
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High Baud Rate Ceramic Packages for Integrated Coherent Receiver (ICR) | Sinopack manufactures 100Gbps (4x25Gbps) packages, RF Layout: GSSG x 4ch Sinopack devotes to the R&D and manufacturing of multilayer ceramic pa... |
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25Gbps Ceramic Leadless Chip Carriers (CLCC) for Modulator Drivers | Surface Mount Packages Low Insertion Loss: -1dB min. (DC~32GHz) Low Return Loss: -15dB max. (DC~32GHz) Cu-Mo Heat Sink Sinopack devotes to the R&am... |
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