Sinopack Ceramic Packages for High Power Laser Devices
Using for metal wall - ceramic feedthrough structure, high electrical conductivity, lead can withstand high current. Heat sink for the heat conductivity material, satisfies the requirement of high power device cooling. Custom development for the users.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Sinopack Ceramic Packages for High Power Laser Devices | Using for metal wall - ceramic feedthrough structure, high electrical conductivity, lead can withstand high current. Heat sink for the heat conduct... |
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ALN / Alumina substrates for semiconductor laser diodes and photodiodes | Sinopack provides ceramic submounts for semiconductor laser diodes and photodiodes in fiber-optic communication modules. Both aluminum nitride (AlN... |
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Sinopack Ceramic Packages Manufacturer for Wireless Communication Devices | Sinopack provides ceramic-to-metal seal packages for RF power transistors such as FETs and HEMTs. Ceramic feedthroughs with low electrical-resistan... |
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Sinopack Ceramic Packages for Cooled Infrared Detectors | Ceramic Packages for Cooled Infrared Detectors plays a high airtight work condition, mechanical support and protection, the function of the circuit... |
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100Gbps Packages for Integrated Coherent Receivers (ICR) Gen 1.2 | Sinopack manufactures 100Gbps (4x25Gbps) packages, RF Layout: GSSG x 4ch with 0.8/1.0mm pitch Sinopack devotes to the R&D and manufacturing of ... |
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