Sinopack Ceramic Packages for High Power Laser Devices
Using for metal wall - ceramic feedthrough structure, high electrical conductivity, lead can withstand high current. Heat sink for the heat conductivity material, satisfies the requirement of high power device cooling. Custom development for the users.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Sinopack Ceramic Packages for High Power Laser Devices | Using for metal wall - ceramic feedthrough structure, high electrical conductivity, lead can withstand high current. Heat sink for the heat conduct... |
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TO-254 and TO-257 Ceramic Packages for Power Electronics | Sinopack provides power electronics packages by using ceramic-to-metal bonding technologies Sinopack devotes to the R&D and manufacturing of mu... |
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Sinopack Standard Ceramic Packages with Lids for Device Evaluation | Sinopack offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP)... |
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Sinopack Hermetic Ceramic Packages for MEMS Sensors | Sinopack offers hermetic ceramic packages with superior mechanical properties, suitable for small, high density, and surface mountable applications... |
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ALN / Alumina substrates for semiconductor laser diodes and photodiodes | Sinopack provides ceramic submounts for semiconductor laser diodes and photodiodes in fiber-optic communication modules. Both aluminum nitride (AlN... |
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