刚性覆铜板
Specification:
CCLthickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm
Thermalconductivity:1.0W/m.k,1.5W/m.k,2.0W/m.k,3.0W/m.k
Dielectricthickness:80um-150um
Copperfoil:1OZ,2OZ,3OZ
Supplysize:500*600mm/400*1200mm/500*1200mm/600*1200mm,Wecansupplyothersizeuponrequest.
ItemNo.:AL-H-06
Feature:
MeettheRoHSrequirements
Excellentthermalconductivity
Solderexcellentperformance
Outstandingreliability
Goodmachinability
Excellentdimensionalstability
Electromagneticwaveshielding
Application:
Coppercladlaminateistheelectronicindustrialbasematerial,mainlyusedforthemanufactureofprintedcircuitboard(PCB),widelyappliedintelevision,radio,computer,mobilecommunicationsandotherelectronicproducts.
在线联系供应商
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Aluminum Base Copper Clad Laminate | Specification: CCLthickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm Thermalconductivity:1.0W/m.k,1.5W/m.k,2.0W/m.k,3.0W/m.k Dielec... |
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刚性覆铜板 | Specification: CCLthickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm Thermalconductivity:1.0W/m.k,1.5W/m.k,2.0W/m.k,3.0W/m.k Dielectri... |
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铝基覆铜板 | 规格: 导热率:1.0W/m.k , 1.5W/m.k ,2.0W/m.k , 3.0W/m.k 1.铝基厚度:0.6mm / 0.8mm /0.9mm / 1.0mm / 1.1mm / 1.2mm / 1.4mm / 1.5mm / 1.9mm / 2.0mm / 2.5mm /3.0... |
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覆铜板 | Specification: CCLthickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm Thermalconductivity:1.0W/m.k,1.5W/m.k,2.0W/m.k,3.0W/m.k Dielectri... |
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