Reflow Oven Soldering Process

The reflow soldering processis a surface-mounted board, and its process is more complicated which can be divided into two types: single-sided mounting and double-sided mounting.

A single-sided mounting: pre-coated solder paste → patch (divided into manual placement and machine automatic placement) → reflow soldering → inspection and electrical test.

B double-sided placement: Aside pre-coated solder paste → patch (divided into manual placement and machine automatic placement) → reflow soldering → B side pre-coated solder paste → placement (divided into manual placement and machine automatic placement) → reflow soldering → inspection and electrical test.

The simple process of reflow soldering is "screen printing solder paste-patch-reflow soldering, the core of which is the accuracy of the screen printing. For the patch, the yield rate is determined by the machine's PPM. The reflow soldering is to control the temperature rise and high temperature. And falling temperature curve.

What is a Reflow Oven?

A reflow oven is an indispensable machine in the SMT production line. It is mainly used for soldering circuit boards with mounted components. The solder paste is melted by heating to fuse the chip components and the circuit board pads. Then the solder paste is cooled by a reflow oven to cool the components and the pads which are cured together. A reflow oven is a kind of machine that is completed by soldering the parts on the PCB board through reflow soldering.

How Does a Reflow Oven Work?

Soldering Techniques in PCB

PCB soldering technology in the process of electronic industry development in recent years, it can be noted that a very obvious trend is reflow soldering technology. In principle, traditional plug-in parts can also be reflow soldered, which is commonly referred to as through-hole reflow soldering. The advantage is that it is possible to complete all solder joints at the same time, minimizing production costs.

Soldering Temperature for SMD Components

Take the temperature rise-heat preservation-peak temperature curve as an example, the requirements are as follows:

1. ～1℃/s or below 4℃/s, depending on the solder paste and components.

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