Laser Module gold plating
Professional electronic package housing manufacturer, company collection housing
Design, processing and sales. At the same time in electronic packaging materials
The surface treatment process of the material is extremely mature and stable.
Effective treatment of aluminum silicon, aluminum silicon carbide, tungsten copper, molybdenum copper, titanium alloy
Special materials such as stainless steel, with mature glass---metal burning
Knotted process and more complete electroplating to meet the different needs of customers
Can be plated with high solderability pure Au, Ni。 nickel, Ag, Cu,
Hard chrome, decorative chrome, etc. The company has strong technical strength and is willing to work with customers.
In-depth cooperation to solve customer problems in related fields
To achieve a win-win development for both parties.
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Ceramic heat sink |
WOCHENG-Features
Circuits are able to be printed on substrates that have through-holes or slits cut out.
Air bridges, side patterns, and AuSn s... |
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Ceramic Submount |
Ceramic Submount
Applications: Semiconductor lasers for optical communications; industrial lasers; LED package substrates.
The types of ceramic mat... |
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Plating thick gold |
Coating thickness: 0.5 to 10μm |
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PD/LD Heater Submount |
WOCHENG offers build-to print service for a wide range of materials and metalization schemes. * Substrates range from As-Fired Alumina,Polished Alu... |
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Alumina99.6% thin film circuit |
Thin film ceramic circuit:1. Product features:The thin film circuit refers to a circuit that forms a specific function by integrating a resistor, a... |
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