Epoxy potting sealants WOC-87-II(A)/G-8402(B)
■ Description
Two-component encapsulating system based on epoxy resin, formed from auxiliaries including epoxy resin, diluent, compound anhydride.
Excellent of the surface gloss of the cured epoxy resin, excellentelectrical properties and have flame retardant property.
■ Applications
Encapsulation of electrical components of Capacitor, Inductor, Igniter, Transformer, trigger and Filter.
■ General properties
|
Test Item |
Test Mothed/Conditions |
WOC-87-II A |
G-8402 B |
|
Appearance |
Visualization |
All color viscous liquid |
Slight yellow transparent liquid |
|
Density |
25º C g/m³ |
|
|
|
Viscosity |
40º C mpa.s |
1000 - 5000 |
15 - 40 |
|
Viscosity(blended) |
40º C mpa.s |
300±200 |
|
|
Storage validity |
Sealed and storage Temp.below 25º C |
6 months |
6 months |
|
Ratio of blend |
Weight/Weight |
100 |
30 |
|
Curing condition |
º C/hrs |
75 º C/1h or 90 º C/2.5h |
|
■ Characteristics after curing
|
Item |
Unit/Conditions |
WOC-87-II A/G-8402 B |
|
Hardness |
20º C Shore-D |
＞80 |
|
Insulation Strength |
25º C kv/mm |
≥18 |
|
Bending Strength |
Kg/cm2 |
≥81 |
|
Heat/cold Shock Resistance |
-20 to 120º C |
Cycle times: more than 5 |
|
Flame Retardancy |
UL 94 |
V0 or V1 |
|
Surface Resistance |
25º C Ω.cm |
＞1014 |
|
Volume Resistance |
25º C Ω.cm |
＞1015 |
|
Curing Shrinkage Rate |
% |
＜0.8 |
|
Glass transition temperature |
Tgº C |
≥85 |
■ Storage, Packaging
- Sealed and storage Temperature below 25º C after each operation
- Please see the term of validity in each packages
- Packages: A component is 25kg, B component is 10kg or 25kg
- The storage validity is 6 months, a little precipitate shall be occurred provided high temperature. Please stir the material before using.
Note: The above data was tested under the conditions of 70% humidity and 25º C Temperature, This is for your reference only.
Send product request
Other supplier products
 |
Epoxy potting adhesives WOCC-A/WOCC-B | ■ Description Two-component encapsulating system based on epoxy resin, formed from auxiliaries including epoxy resin, diluent, Aluminum hydroxide,... |
 |
Epoxy potting adhesives WOC-5203(A)/WOC-5203 (B) | ■ Description Two-component encapsulating system based on epoxy resin, is room temperature curing as well as middle temperature curing epoxy resin... |
 |
Epoxy Resin Adhesive for Battery EC-42 | ■ Description Adhesive for Cover container: is mainly used for the seal bond of cover and container. Excellent bond strength, good acid resistanc... |
 |
Epoxy potting sealants WOC-87-II-D(A)/(B) | ■ Description The product is heat conduction type epoxy adhesive, it is two-component epoxy adhesive. Curing under room termperature, low of sh... |
 |
Polyurethane potting sealants WPU-A80A/B | ■ Description Two-component encapsulating system based on polyurethane, formed from polyurethane, curing agents and additives by special productio... |
Same products
 |
Automotive & Marine Adhesive Sealant | Seller: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | Automotive & Marine Adhesive Sealant is designed for demanding bonding and sealing appli... |
 |
MS waterproof coating sealant | Seller: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | MS waterproof coating sealant MS Waterproof Coating Sealant GluePro is designed for liquid-... |
 |
MS Polymer Sealant For Window and Door | Seller: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | MS Polymer Sealant For Window and Door GluePro is designed for professional home decoration,... |
 |
ODM-606 Water-Based Intumescent Firestop Sealant | Seller: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | ODM-606 Water-Based Intumescent Firestop Sealant ODM-606 WATERBORNE FIRESTOP SEALANT is an ... |
 |
electronic potting compound supplier | Seller: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | electronic potting compound supplier Ordovician Mind manufactures a comprehensive range of E... |
