.

BGA 测试座12

ShenzhenYounRongDamicroelectronicstechnologyco.Ltdisaprofessionalsemiconductortestprogramdevelopment,manufacturingandsalesenterprises,withtenyearsofresearchandtestingsocketmakingexperience,.Wemainlyprovidechiptestsocket,burningfixture,programmingdevice,EMMC/TSOPtestsocket,camerachiptestsocket(sensor),automatedtestsocketandconnectortesting.

Contact:Gracexie

Phone:

Mobile:

EP2S15F672C4BGAtestsocketfeature

  1. Uppercoveradopthandrotatestructure,sensitiveoperation.2.Pressplateofsocketheadadopthumanizationstructure,balancepress,guaranteeICpressequality,andwon’tskewing.3.CrownshapeofPogopinbeabletobreakoxidelayerofsolderball,contactstable,protectsolderballshape.4.Rationalizationlocatingslot,GuideholecanmakesureIClocationright.5SpecialICsupportplatestructure,protectPogopinfreeofoutsideforce.
  2. importPogopin,BECUplatedhardgolden,rhodium.Worklifetimeover100000times.
  3. Lowcostformaintenance,easytochangepin,costefficiency.
  4. Matureworkingaccuracyrange:pitch=0.3mm

10.Deliverytime:inthreedaysearliest.

YuanRongDaserviceprotectionaftersale.

  1. Freemaintenancein100days(exceptman-madedamage)
  2. Freemaintenanceafterwarranty,onlychargematerialcostiftherehavenecessary.
  3. YuanRongDafreeproviderelatedtechnicalsupport.

YuanRongDaservicebeforesale.

  1. Provideoperationspecificationandmaintenanceitems..
  2. Freetrainhowtousethisproduct.

12


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