MJ Z21 Universal CPU Reballing Stencil For iPhone 6-14 Pro Max Repair
Xinzhizao T8-CPU reballing stencil platform with magnetic base for A8 A9 A10 A11 A12 A13 A14 A15 CPU soldering repair. XZZ 18 in 1 middle layer reballing platform for iPhone X-14 Pro Max motherboard soldering repair.
Option:
1. Xinzhizao T8-CPU reballing platform set(A8-A15 CPU).
2. Xinzhizao 18 IN 1 middle frame reballing platform set(iPhone X-14 Pro Max).
Features:
1. Strong magnetic adsorption, built-in strong magnetic.
2. Non-disassembling, easy to use.
3. Position quickly.
4. High-temperature resistance and abrasion resistance imported alloy steel, metal fatigue resistance, make the product use more durable.
5. Imported alloy steel, high material, and technology, anti-fouling, easy to clean.
6. Suitable for iPhone A8 A9 A10 a11 A12 A13 A14 A15 CPU, iPhone X-14 Pro Max middle layer frame.
7. 0.1mm stencil: the square hole is completely pierced.
8. 0.12mm stencil: the square hole is not completely pierced.
9: Magnetic base, positioning plate, stencil.
T8-CPU 8 in 1 set:
1x Magnetic base.
1x Positioning plate.
1x 0.12mm A8 stencil.
1x 0.12mm A9 stencil.
1x 0.12mm A10 stencil.
1x 0.12mm A11 stencil.
1x 0.12mm A12 stencil.
1x 0.12mm A13 stencil.
1x 0.12mm A14 stencil.
1x 0.12mm A15 stencil.
Installation:
1. Separate the magnetic base and positioning plate, secure the IC to the corresponding position (needs to be consistent with the direction of the steel mesh).
2. Place the steel mesh directly on the slot (note that the mesh is aligned with the bottom chip).
3. Place the positioning plate on the magnetic base, the installation is complete.
4. Preheat the stencil with a hot air gun, and then blow it in the IC opening position.
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