PCB Fabrication
Products and ServicesTopscom has the ability to build virtually all multilayer board designs produced.Multilayer TechnologiesQTA and PrototypingHigh Performance MaterialsMCM/SubstratesMicroviaBackpanelsCapabilitiesTechnology RoadmapEngineering ServicesSurface FinishesProduct DevelopmentProduction EquipmentResearch and DevelopmentFront End CapabilitiesAnalytical ServicesMaterialsTopscom has extensive experience with materials, ranging from mid-range FR-4 to Polyimide, Teflon, Cynate Ester and BT. Hybrid application for complex RF, Microwave, and Antenna products are our specialty. The use of High Tg, Low loss 's High speed Dielectrics is growing with the increasing functionality and speed for the character, voice and image path transition. Topscom can provide alternative solutions for hard to find materials based on desired electrical performance requirements.Materials ChartBuried CapacitanceHybrid ApplicationsBuried Resistors Pcb Layout Experience ExperienceCapabilityYear Experience10N/ALayout Size16'' X 13''All dimensionPoint Connect20,000 pinDesign dependentLayers20 layersDesign dependentSpeedGIGA / OC48Up to 10 GTrace Thickness½, 1 oz Cu＞＞ ½ oz CuTrace Width5/6/8 mil＞ 3 milMaterialFR-4 natural expoxyFR 4-06Dielectric Thickness5 mil＜ 4 milBackplane24 layersDesign dependentICT Test Point100%100%
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Topscom engineers are experts in electronic system design and have vast product experience including wireless PDAs, digital cameras, medical device... |
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Automated Optical Inspection (AOI) is a powerful tool for assessing workmanship compliance in Prototype as well as Production PCB assembly environm... |
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Pcb Tunrkey Assembly ServiceSMT Line: Fuji and Siemens IC Mounter SMT,Final Assembly E-TestSMT Line Workshop Topscom integrates quality ISO certi... |
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Having procurement offices in strategic locations around the world, and by consolidating our procurement advantage in China, we are able to share o... |
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Topscom has conducted comprehensive evaluations of alternative PCB finishes including immersion silver (I-Ag) and immersion tin (I-Sn). Our studies... |
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