.

High Density Board

HighTGPCBboardsareappliedtoawiderangeofHigh-techindustriessuchas:computer,mobile,infrastructureandservermarket,medical,automotive,industrial,communications,andmeasurementmarket.etc.

Byunremittingworkandefforttothemarketing,HighTemperaturePcbproductsaregettingmoreandmorepopularinusabilityanduniversality.

BaseMaterial:FR-4,CEM-1,CEM-3,highTG,FR4halogenfree,rogers

NumberofLayers:1~28Layer

BoardThickness:0.21to7.0mm

CopperThickness:0.5OZto7.0OZ

SurfaceFinishing:HASL/HASLleadfree,HAL,chemicaltin,chemicalgold,immersionsilver/gold,OSP,goldplating

SolderMaskColor:Green,Red,White,Yellow,Black,Blue,Customized

CapabilitiesofTGmaterial:

Singleanddouble-sidedstandardflex,reel-to-reelfabricationprocessingofsingleanddouble-sidedstandardflexcircuitry,widetechnologyrangefromscreenprintingtohighdensityphotoimagedflexcircuitry,verticalIntegrationstrengthonFlexiblelaminatesandtapes,circuitfabrication,andcomponentassembly,multilayerandAirgapFlexcircuitupto8layers,rigidFlexupto12layerswithhighroutingdensity.

Ability:SinoFastInternationalCorporationcanmeetallyourPCBmanufacturingneedsfromsingle-sidedtocomplexmulti-layeredPCB.

Bestsoftware:Allordersreceiveandengineeringfilereviewbeforegoingtofabricationanddownloadtheindustry'sbestPCBboarddesignsoftware.

Effectivemanufacture:SinoFasthasaconsistenton-timeshippingrecordandwearenowshippingmanyofourordersearly!

NoMOQ:Wedon’thaveanyminimumlotrequirements,soyouneverhavetobuymorethanwhatyouneed.

Fastshipping:SinoFastcanprovidequickshippingthroughShenzhenandHongKongport.


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