iFixes i504L iN223 iN559 100g lead-free flux paste BGA Repair Solder Paste for Mobile Phone PCB PGA BGA SMD rework soldering repair. iFixes Lead-free halogen-free solder paste welding paste finishing soldering consumables suitable for Circuit Boards nano chips, mobile PCB,SMT repair, electronic components, BGA chip ball soldering.
Features:
1. iFixes lead-free halogen-free solder paste 100g large-capacity packaging mobile finishing welding consumables series.
2. Good welding ability, no corrosion and no residue, reduce needle test interference and keep the appearance of the weld beautiful.
3. Lead-Free Eco-Friendly: supports high-demand soldering tasks, such as smart PCB repairs and BGA chip reballing.
4. The syringe injection dosage is accurate and there is no welding waste.
5. Suitable for nano chips, mobile PCB, SMT repair, electronic components, BGA chip ball soldering.
Option:
1. iFixesi504L Yellow BGA Solder Paste 100g.
2. iFixesiN223 BGA Repair Solder Paste 100g.
3. iFixesiN559 BGA Repair Solder Paste 100g.
Product Parameters:
Name: Lead-free halogen-free solder paste.
Net Weight: 100g.
Storage Recommendations: Store in a cool, indoor environment, away from heat sources to maintain product quality.
Note:solder paste can only can be sent out by special mail post.
