SUNSHINE SS-890D Laser Desoldering Machine
描述
阳光SS-890D红外线激光拆焊机诊断/焊接/拆焊手机平板主板BGA CPU IC。 SS-890D红外线激光拆焊机带显微镜HDMI 48MP摄像头10寸显示屏。 SS-890D激光拆焊机，具有故障诊断、激光加热拆解、BGA CPU IC焊接功能，适用于手机维修。
特征：
1.支持恒温设置。
2. 双光相机。 红外摄像头和可见光摄像头。
3、实时监控。 短路诊断、电子显微镜、拆焊机、快照/视频。
4. 适用于CPU/IC/Nand flash/电阻/电容拆装、除胶、植锡焊接等。
5.带有7英寸红外成像显示触摸屏。
6. 48MP HDMI 摄像头。
7. 10英寸可见光成像显示器。
8.支持拆焊所有型号/品牌的手机主板及其他带主板的产品等。
9、使用红外摄像头可以轻松检测主板异常区域，使用可见光摄像头提取主板轮廓，灵活放大主板细节，快速准确找出问题所在。
10、既是短路快速诊断仪，又是电子显微镜，还是拆焊台，抓图/录像，可检测温度报警，可根据情况手动调节温度， 拆焊主板可以监测温度是否达到熔点。
11、智能触摸按键，触感灵敏稳定，测量速度快，使用方便。
12、电压：110-220V。
13、激光功率：30W。
在线联系供应商
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