MIL-DTL-32139 NANO D CONNECTOR
In addition to the standard range of Micro-D connectors and assemblies, Sunkye' is able to offer Nano-D connectors and assemblies based on the highly reliable Twist Pin contact technology.
nano miniature connectors Description：
MIL-DTL-32139 Nano D connectors are ideal solutions for applications including aerospace, military, industrial, medical or off-shore which require extreme miniaturization, space or weight saving and reliability. Sunkye' Nano-D connectors meet the requirements of MIL-DTL-32139.
The Twist Pin contact by its design and performance enables the system to meet the most severe requirements – often significantly more so than stipulated in the MIL-DTL-83513 and MIL-DTL-32139 standards. The male Micro-D contact is made up of 10 strands of beryllium-copper and copper alloy twisted together, welded then bumped. These sprung strands are in fact compressed during insertion into the turned female contact and therefore a high number of electrical contact points are permanently assured while retaining flexibility and ease of insertion/ extraction. The bulged point will be compressed inside the socket during insertion. Insertion and retention performance of the twist pin and socket mated pair. Both socket contact chamfer and twist pin hemispherical radius contribute to ensuring adequate insertion even in case of misalignment.
Different configurations Sunkye's range of Nano-D connectors is available in several different configurations:
- Nano-D rectangular connectors for cables.
- Nano-D rectangular connectors for PCBs.
- EMI versions.
- High-density Micro-D connectors.
nano connectors Characteristics
- 0.635 mm (.025") contact spacing (double the density of a Micro-D).
- The number of contacts: 9, 15, 21, 25, 31, 37 and 51.
- double row.
- High-reliability twist pin contacts.
- Metal shell construction with captivated hardware.
Sunkye’ has also developed custom-designed Nano-D connectors:
- High density circular Nano-D connectors.
Special Nano-D connectors available on request.
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