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Reflow Oven

With the development of SMT technology, a variety of SMC and SMD, reflow soldering technology and equipment, which are part of SMT technology, have been developed accordingly, and its application is becoming more and more extensive.

R is no stranger in the electronics manufacturing field. The components on the various boards used in our computers are welded to the circuit board by this process. The device has a heating circuit inside that heats the nitrogen to a high enough temperature to blow onto the printed circuit board, allowing the solder on either side to melt and bond to the motherboard.

The advantage of this process is that temperature is easy to control, oxidation is avoided during welding, and manufacturing costs are easier to control. When soldering with reflow soldering technology, it is not necessary to immerse the printed circuit board into molten solder, but to use local heating to complete the welding task, as a result, the welded components suffer little thermal shock and will not cause damage to the components due to overheating. As the welding technology only needs to put welding materials at the welding position, and partial heating is required to complete the welding, so welding defects are avoided. Also in reflow soldering technology,  are used only in a secondary way, and there is no re-use situation. Therefore, the solders are clean and free of impurities, which ensures the quality of solders.



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