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Key Specifications/Special Features: Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen-free, FR-1, FR-2 and aluminum Speed: 0.3 to 0.16s/piece Layer: 1 to 30 layers Board thickness: 0.2 to 7mm Maximum finished board side: 610 x 711mm (24 x 28-inch) Minimum drilled hole size: 0.15mm Minimum line width: 0.075mm (3mil) Minimum line spacing: 0.075mm (3mil) Surface finish:HALS lead-free, chemical tin, chemical gold, immersion gold, immersion silver/gold, OSP and gold plating Copper thickness: 0.5 to 6.0oz Solder mask colors: green, black, white, red, blue or yellow Hole tolerance: PTH: ±0.076 NTPH: ±0.05 Components size can reach to 0201, accuracy can reach to 0.1mm Can SMT PLCC, QFP, BGA and CSP Leg distance can reach 0.3mm Profiling punching routing, V-cut and beveling SMT/DIP mixed SMT/DIP TFT, drive-engine, mobile main board, battery protection circuit and some other difficult products and components are also available Small and OEM services are welcome Reference standard: IPC-A-600G Class 2 Certifications: UL and CE Compliant with the RoHS Directive Packing: Inner: vacuum and plastic bag Outer: standard carton



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