BGA PCB Assembly
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Soldering of BGAdevices requires precise control and is usually done by automated processes.
Advantages of China BGA PCB Assembly
Heat conduction: BGA circuits allow heat to pass much more easily from the integrated circuit outwards, reducing overheating problems.
Lower inductance: Because each solder ball in a BGA Chinacircuit is generally only a handful of millimeters large, problems from interference within the circuit are greatly minimized.
Higher-density circuits: As through-hole circuits of pcb assembly BGAwere more densely-populated, soldering them accurately without crossover or short-circuits became nearly impossible.
If you are looking for a reliable bga company, don't hesitate to contact us!
For more information about electronic manufacturing service chinaand circuit board assembly, please feel free to contact us!
在线联系供应商
Other supplier products
 |
DELIVER MOLDING MECHANICAL DESIGNS SYSTEMATICALLY | DELIVER MOLDING MECHANICAL DESIGNS SYSTEMATICALLY GreensTone mechanical design engineers will work with your team to design and test the best solu... |
 |
Electronics Manufacturing & Assembly Service | GreensTone specializes in contract manufacturing of printed circuit board assemblies (PCBAs), subsystem integration and full-box builds. VALUE-ADD... |
 |
PCB Assembly Service | GreensTone specializes in the one stopPCBassemblies, including: Circuit board assembly Surface mount technologies (SMT) Pin Through Hole ... |
 |
FR4 PCB | What is FR4? FR4is the name of a type of epoxy glazing material. fr stands for flame retardant. 4 refers to the factors that differentiate it from... |
 |
BGA PCB Assembly | A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mo... |
Same products
 |
Electric Ebike Components & Parts | 卖方: Hangzhou Lantu Technology Co.,Ltd | Looking for premium quality spare parts for your electric bike? Look no further than Lantu Ebike.... |
 |
Electric Bike Motor | 卖方: Hangzhou Lantu Technology Co.,Ltd | This electric bike 750w hub motor, compatible with disc brakes, is rated at 1000W with a reductio... |
 |
Electric Bike Battery | 卖方: Hangzhou Lantu Technology Co.,Ltd | The electric cycle removable batterycomes with a mounting plate that attaches to most water bottl... |
 |
Electric Bike | 卖方: Hangzhou Lantu Technology Co.,Ltd | After 14 years of intensive cultivation, customers are absolutely assured of the quality of Lantu... |
 |
EEC Electric Scooter | 卖方: Hangzhou Lantu Technology Co.,Ltd | Revenge, our best-selling EEC electric scooter with EEC/COC certified and a maximum speed of 45km... |
