PCB Capability

PCBFabrication Capabilities

GreensTone has successfully served customers with printed circuit boardmanufacturing service in communication, industial devices, new engrgy, power supply, sensors, smart home applications control, smart industial control , medical devices and security control device and so on.

GreensTone PCB Quality Control

For every orders we recieved, Gerber files should be checked by our PCB engineers before sending to production. Engineers would help to check the board edge clearance, drilling, pad spacing, impedance and routing. if the engineer finds a problem with the file or something can't be optimized, our engineers will contact the customer to confirm the files again.

The quality of the raw materials determines the quality of the finished products. GreensTone has been working with leading suppliers in the industry,and apply materials as to international standards and customer requirements, such as Rogers, Shengyi, KB (kingboard) sheet, Rohm&Haas, TAIYO for solder mask ink.

To ensure the quality and reliability of PCB products, GreensTone continuously introduces advanced equipment to improve their pcb manufacturing capabilities, including:

Automatic solder mask production line

LDI exposure machine

Fully automatic PCB etching equipments line

Fully automatic PCB testing machine line

Fully automatic electroplating line

Automatic silkscreen printing production line

Comply with ISO9001:2015 requirements

Production processes are in line with IPC standards

Basic visual inspections

Rigorous electrical tests.

Flying Probe Testing

AOI (Automated Optical Inspection)

Copper Thickness Tester

Specification of PCB Capability

Item	PCB Capability
Layers	1-8 layers
Thicker Copper	1- 4OZ
Products Type	HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board, BGA& Fine Pitch board
Solder Mask	Red, green, yellow, white, blue, black, Matt black
Base material	FR4, HI-TG, heavy copper and so on
Finished Surface	Conventional HASL, Lead-free HASL, Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin, Immersion Silver, Hard Gold
Technical Specification	Minimum line width/gap: 3.5/4mil(laser drill)
	Minimum hole size: 0.15mm(mechanical drill)/4mil(laser drill)
	Minimum Annular Ring: 4mil
	Max Copper thickness: 4OZ
	Max Production size: 900×1200mm
	Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm
	Min Solder Mask Bridge: 0.08mm
	Aspect ratio: 15:1
	Plugging Visa capability: 0.2-0.8mm
Tolerance	Plated holes Tolerance: 0.08mm(min±0.05)
	Non-plated hole tolerance: 0.05min(min+0/-0.05mm or +0.05/-0mm)
	Outline Tolerance: 0.15min(min±0.10mm)
	Insulating resistance: 50 ohms (normality)
	Peel off strength: 1.4N/mm
	Thermal Stress test: 2650c,20 seconds
	Solder mask hardness: 6H
	E-Test voltage: 500V+15/-0V 30S
	Warp and Twist: 0.7% (semiconductor test board≤0.3% )
Silkscreen	White, Black, None
Panelization	V-scoring,
	Tab-routing,
	Tab-routing with Perforation (Stamp Holes
Others	Fly Probe Testing (Free) and A.O.I. testing(free), ISO 9001:2008 , UL Certificate

As one of electronic contract manufacturing companies, we will do our best to meet all the needs of customers.

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