双面无铅锡线路板生产
Ourpcbcapability
1)Layer:1-28layers
2)Boardfinishedthickness:0.21mm-7.0mm
3)Material:FR-4,CEM-1,CEM-3,HighTG,FR4HalogenFree,Rogers,Aluminum
4)Max.finishedboardsize:23×25(580mm×900mm)
5)Min.drilledholesize:3mil(0.075mm)
6)Min.Linewidth:3mil(0.075mm)
7)Surfacefinish/treatment:HASL/HASLleadfree,HAL,Chemicaltin,ChemicalGold,ImmersionSilver/Gold,OSP,Goldplating
8)Copperthickness:0.5-7.0OZ
9)Soldermaskcolor:green/yellow/black/white/red/blue
10)Copperthicknessinhole:>25.0um(>1mil)
11)Innerpacking:Vacuumpacking/Plasticbag
Outerpacking:Standardcartonpacking
12)Shapetolerance:±0.13
Holetolerance:PTH:±0.076NPTH:±0.05
13)Certificate:UL,ISO9001,ISO14001,
14)Specialrequirements:Buriedandblindvias+controlledimpedance+BGA
15)Profiling:Punching,Routing,V-CUT,Beveling
16)ProvidesOEMservicestoallsortsofprintedcircuitboardassemblyaswellaselectronicencasedproducts.
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