4 Layer OSP+ENIG PCB
Project Description
|Parameters
4 Layer
Thickness: 1.2+/-0.12 mm
Min Hole Size: 0.3 mm
Width/Space: 0.12mm/0.12 mm
Surface Treatment: ENIG
|Craft
Red Ink
ENIG+OSP
|Application
Consumer Electronics
4 Layer
Thickness: 1.2+/-0.12 mm
Min Hole Size: 0.3 mm
Width/Space: 0.12mm/0.12 mm
Surface Treatment: ENIG
|Craft
Red Ink
ENIG+OSP
|Application
Consumer Electronics
在线联系供应商
Other supplier products
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HEAT DISSIPATION MCPCBION MCPCB | Project Description |Parameters1 LayerThickness: 1.2+/-0.1 mmMin Hole Size: 3.175 mmWidth/Space: 0.12mm/0.1 mmSurface Treatment: OSP|CraftWhite Ink... | |
Flexible PCB Cable | Project Description |Parameters4 LayerThickness: 0.25+/-0.1 mmMin Hole Size: 0.3 mmWidth/Space: 0.2mm/0.15 mmSurface Treatment: Flash Gold plating|... | |
6 layer heavy ENIG board | Project Description |Parameters6 LayerThickness: 1.8+/-0.18 mmMin Hole Size: 0.25 mmWidth/Space: 0.2mm/0.2 mmSurface Treatment: ENIG|CraftGold Fing... | |
4 Layer OSP+ENIG PCB | Project Description |Parameters4 LayerThickness: 1.2+/-0.12 mmMin Hole Size: 0.3 mmWidth/Space: 0.12mm/0.12 mmSurface Treatment: ENIG|CraftRed InkE... |
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