Handheld electronic device main board
Productname:Handheldelectronicdevicemainboard
lowcostpcbfabrication
Characteristic
BlindL1-L2.L5-L6
BuriedL2-L5
ThroughholeL1-L8
manufacturingpcbchina
Specifications
Layercount:6
Boardthickness:1.0mm
Basematerials:FR4S1000-2
Finishedsize:212*170mm
Surfacefinish:Immersion+OSP
Linewidth/linespace:3/3mil
Minimumhole:0.10mm
Solderresistcolor:Lightblue
innerlayerHOZouterlayer1OZ
在线联系供应商
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