Chemical Mechanical Polisher

The Chemical Mechanical Polisher is widely used in laboratory and pilot-scale environments for polishing process optimization and material behavior studies, including:

Semiconductor wafer polishing (Si, GaN and related substrates)

Optical component surface finishing

Substrate and thin material planarization

Aerospace material surface preparation

Research on friction, wear, and material removal mechanisms

Typical test objects include semiconductor wafers, optical substrates, bonded pads, and development samples with diameters from 0.5 inch to 4.25 inches.

Standards

The system is primarily intended for research and development applications. It supports experimental setups and evaluation methods commonly referenced in:

(1) Semiconductor CMP process research practices

(2) Optical surface finishing and planarization studies

(3) Tribology and wear mechanism investigation methods

Specific test standards depend on user-defined processes and research objectives.

Parameters

Item	Description
Load Control	Closed-loop loading force control with high-precision force sensor
Torque Measurement	High-resolution online torque measurement
Wafer Holder	Self-leveling fixture with active rotation and horizontal oscillation
Sample Size Range	0.5 inch to 4.25 inches
Platform	Fully automated XY platform with quick-change capability
Speed Control	Wide adjustable speed range via programmable control
Slurry Delivery	Automatic slurry delivery system
Inline Sensors	Torque, temperature, and acoustic emission
Surface Measurement	Integrated inline three-dimensional optical profiler

Features

Real-time measurement of friction coefficient during polishing

Precise control of loading force and rotational speed through closed-loop feedback

Integrated three-dimensional optical surface profiler for inline morphology analysis

Compatibility with multiple wafer and sample sizes

Online monitoring of torque, temperature, and acoustic emission signals for accurate endpoint detection

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