CMP Wafer Polishing Machine Supplier Semiconductor Equipment
Get a quote：
Whats/App: +86 156 1874 6768
Web: standard-groups.com
Chemical Mechanical Polisher is a precision polishing platform designed for process research and product development. It integrates chemical mechanical polishing with closed-loop load control, a wide speed range, automated slurry delivery, and real-time signal monitoring. By combining polishing capability with an inline three-dimensional surface profiler, this system enables detailed investigation of surface topography, friction, and wear evolution during the polishing process, supporting accurate optimization of polishing parameters.
Standards
The system is primarily intended for research and development applications. It supports experimental setups and evaluation methods commonly referenced in:
(1) Semiconductor CMP process research practices
(2) Optical surface finishing and planarization studies
(3) Tribology and wear mechanism investigation methods
Specific test standards depend on user-defined processes and research objectives.
Parameters
| Item | Description |
|---|---|
| Load Control | Closed-loop loading force control with high-precision force sensor |
| Torque Measurement | High-resolution online torque measurement |
| Wafer Holder | Self-leveling fixture with active rotation and horizontal oscillation |
| Sample Size Range | 0.5 inch to 4.25 inches |
| Platform | Fully automated XY platform with quick-change capability |
| Speed Control | Wide adjustable speed range via programmable control |
| Slurry Delivery | Automatic slurry delivery system |
| Inline Sensors | Torque, temperature, and acoustic emission |
| Surface Measurement | Integrated inline three-dimensional optical profiler |
Features
Real-time measurement of friction coefficient during polishing
Precise control of loading force and rotational speed through closed-loop feedback
Integrated three-dimensional optical surface profiler for inline morphology analysis
Compatibility with multiple wafer and sample sizes
Online monitoring of torque, temperature, and acoustic emission signals for accurate endpoint detection
Accessories
(1) Self-leveling wafer fixture
(2) Quick-change wafer and pad holders
(3) Automatic slurry delivery system
(4) Inline torque sensor
(5) Acoustic emission sensor
(6) Online temperature monitoring module
(7) Integrated 3D optical profiler
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