Titanium carbide powder with strong antioxidant performance
该粉末表面改性后，能与树脂、塑料等有机材料良好结合，形成兼具硬度和韧性的金属陶瓷复合材料，广泛应用于高尔夫球头等体育用品，在保证强度的同时减轻了重量。该粉末磁导率较低，适用于制作高频电磁屏蔽材料，可有效降低5G通讯设备中的电磁干扰。在航空航天领域，可用于制备轻量化、高强度的结构件，减轻飞机重量。该粉末具有优异的导电性和导热性，其电导率为3×10⁴S/m，热导率为35W/(m·K)，可用于制作导电陶瓷、加热元件等。与铜粉复合后，所得复合材料兼具高硬度和高导电性，适用于制作火花电极，电极损耗率可降低至0.1%以下。该粉末粒度分布窄，D50与D90之比小于1.5，可保证成型坯体密度的均匀性，减少烧结后的变形。在电子封装领域，可用于制备高导热封装材料，解决芯片的散热问题。
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