Thermal CTP
Weifang Hua Guang Digital Equipment Co.,Ltd is one of the famous China thermal ctp manufacturers and suppliers,Website:, we are able to offer you good quality and stable thermal ctp platesetter, thermal laser ctp machine, semi-automatic ctp machine, full automatic ctp machine, 4 up ctp machine, welcome to contact our factory.
Introduction
· HGDE Unique technology of separation of paper and plate, flexible and convenient.
· Auto-focus adjustment makes sure the high output Precision
· High-Power LASER Diode make guarantee of the stable output.
Unique loading model and separation of paper and plate technique
On the CTP plate classification and plate loading, HGDE adopted new technique, utilized different solution that is different from present type and through the adjustment of the whole direction of the plate, making up for the defects that exit at plate loading. HGDE’s plate-loading make the full separation of the paper and plate come true and prevent the problem of overlap of the paper and plate; the pre-plate-loading makes the plate in order and make sure the precision of plate-loading. The HG CTP plate-loading device has applied for the national patent. The HGDE plate-loading solution that break s the tradition and independent innovation is worthy of the clients’trust.
Stable Laser Device and Data Transfer System
(NEC LENS)
The high quality of lasers and perfect laser control technology, make the whole laser device to be perfect.
Through RIP data analysis and dot reproduction technology, make the single or generic data as the signal, in sequence to control, and then through image file compress technology, data separation technology , 1—128 channels Data disperse and Receiving Data Merging technology to achieve the function of natural printing dots reproduction.
High Precision Lead Screw (BOSCH)
Top-class quality lead screw can make sure the stable movement of the laser lens without vibration to make the guarantee that the distance between the lens and the drum is constant and the uniform exposure of the plate. All Motors are adopted from Mitsubishi, Japan.
Perfect Drum Structure
·The drum that with very high quality, the pulsation of the drum surface is less than 8μm.
· Original design of the clamp, flexible and convenient.
·Unique dynamic balancing system, quick and stable.
Electrical Parts
Many of pneumatic parts are adopted. All of related cylinder and air valve are used from SMC to improve the reliability of the whole air channel. Magnetic Sensor Switch and Flow Switch for every cylinder make sure the stability of Movement Speed and Position of Cylinders.
HG-T83-32 specification:
Module
HG-T83/32
Plate-fix mode
External
Laser device
830nm Thermal laser diode.
Laser channel
32 channels
Plate size
Max.830nm*676nm Min.460nm*360nm
Plate thickness
0.13mm---0.4mm
Plate type
thermal
Resolution
2540dpi
Dot repeatability
1%--99%
Production efficiency
≥20p/hr
(830*645)
Loading and unloading mode
Semi-automatic/Full-Automatic
Shape size
1480mm*1760*1080mm
Weight
900Kg
Power supply
AC220V 4.5KVA
Operation environment
Temperature: 18--25℃; Humidity: 30%--60%
※1. It has been adjusted well in the factory.
※2.The Productivity may differ according to the differences of plate size and resolution.
HG-T83-48 Thermal CTP Introduction
Horizontal loading+ continuous processing, space saving and operated easily.
·Unique dynamic balancing adjustment system, quick and stable
·Original system of adjustment of edge plate, flexible and convenient.
· HGDE Unique technology of separation of paper and plate, flexible and convenient.
· Auto-focus adjustment makes sure the high output Precision
· High-Power LASER Diode make guarantee of the stable output.
HG-T83-48 specification:
Module
HG-T83/48
Plate-fix mode
External
Laser device
830nm Thermal laser diode.
Laser channel
48 channels
Plate size
Max.830nm*676nm Min.460nm*360nm
Plate thickness
0.13mm---0.4mm
Plate type
thermal
Resolution
2540dpi
Dot repeatability
1%--99%
Production efficiency
≥26p/hr
(830*645)
Loading and unloading mode
Semi-automatic/Full-Automatic
Shape size
1480mm*1760*1080mm
Weight
900Kg
Power supply
AC220V 4.5KVA
Operation environment
Temperature: 18--25℃; Humidity: 30%--60%
※1. It has been adjusted well in the factory.
※2.The Productivity may differ according to the differences of plate size and resolution.
HG-T83-64 Thermal CTP Introduction
· HGDE Unique technology of separation of paper and plate, flexible and convenient.
· Auto-focus adjustment makes sure the high output Precision
· High-Power LASER Diode make guarantee of the stable output.
HG-T83-64 Specification:
Module
HG-T83/64
Plate-fix mode
External
Laser device
830nm Thermal laser diode.
Laser channel
64 channels
Plate size
Max.830nm*676nm Min.460nm*360nm
Plate thickness
0.13mm---0.4mm
Plate type
thermal
Resolution
2540dpi
Dot repeatability
1%--99%
Production efficiency
≥32p/hr
(830*645)
Loading and unloading mode
Semi-automatic/Full-Automatic
Shape size
1480mm*1760*1080mm
Weight
900Kg
Power supply
AC220V 4.5KVA
Operation environment
Temperature: 18--25℃; Humidity: 30%--60%
※1. It has been adjusted well in the factory.
※2.The Productivity may differ according to the differences of plate size and resolution.
HG-T116-32 Thermal CTP Introduction
HG—T116-32 Thermal CTP specification
Model
HG-T116/32
Plate-fix mode
External
Laser device
830nm Thermal laser diode.
Laser channel
32 channels
Plate size
Max.1160nm*930nm Min.510nm*400nm
Plate thickness
0.13mm---0.4mm
Plate type
thermal
Resolution
2540dpi
Dot repeatability
1%--99%
Production efficiency
≥16p/hr
(1030*800)
Loading and unloading model
Semi-automatic/Full Automatic
Shape size
1860mm*2180*1160mm
Weight
1100Kg
Power supply
AC220V 6.5KVA
Operation Environment
Temperature: 18--25℃; Humidity: 30%--60%
※1. It has been adjusted well in the factory.
※2.The Productivity may differ according to the differences of plate size and resolution.
HG-T116-48 Thermal CTP Introduction
·Horizontal loading+ continuous processing, space saving and operated easily. (Online with Processor)
·Unique dynamic balancing adjustment system, quick and stable
·Original system of adjustment of edge plate, flexible and convenient.
HG—T116-48 Thermal CTP specification
Model
HG-T116/48
Plate-fix mode
External
Laser device
830nm Thermal laser diode.
Laser channel
48 channels
Plate size
Max.1160nm*930nm Min.510nm*400nm
Plate thickness
0.13mm---0.4mm
Plate type
thermal
Resolution
2540dpi
Dot repeatability
1%--99%
Production efficiency
22p/hr
(1030*800)
Loading and unloading model
Semi-automatic/Full Automatic
Shape size
1860mm*2180*1160mm
Weight
1100Kg
Power supply
AC220V 6.5KVA
Operation Environment
Temperature: 18--25℃; Humidity: 30%--60%
※1. It has been adjusted well in the factory.
※2.The Productivity may differ according to the differences of plate size and resolution.
HG-T116-64 Thermal CTP Introduction
·Horizontal loading+ continuous processing, space saving and operated easily. (Online with Processor)
·Unique dynamic balancing adjustment system, quick and stable
·Original system of adjustment of edge plate, flexible and convenient.
HG—T116-64 Thermal CTP specification
Model
HG-T116/64
Plate-fix mode
External
Laser device
830nm Thermal laser diode.
Laser channel
64 channels
Plate size
Max.1160nm*930nm Min.510nm*400nm
Plate thickness
0.13mm---0.4mm
Plate type
thermal
Resolution
2540dpi
Dot repeatability
1%--99%
Production efficiency
≥27p/hr
(1030*800)
Loading and unloading model
Semi-automatic/Full Automatic
Shape size
1860mm*2180*1160mm
Weight
1100Kg
Power supply
AC220V 6.5KVA
Operation Environment
Temperature: 18--25℃; Humidity: 30%--60%
※1. It has been adjusted well in the factory.
※2.The Productivity may differ according to the differences of plate size and resolution.
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