Mobile Internet Devices (MID) Mainboards Chinese Factory
Mobile Internet Devices (MID) Mainboards Material: FR4 Surface finish: ENIG, HASL
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| UL & ISO Printed Circuit Boards(pcb) Supplier | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.3... | |
| 12-layer High Density Interconnector (HDI) Boards Exporter | 12-layer High Density Interconnector boards Thickness:0.8mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.1mm Surface Finish: ENIG+OSP | |
| Small and large series Printed Circuit Boards (PCB) | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.3... | |
| Printed Circuit Boards with purple soldermask Multilayer PCBs | 6L Printed Circuit Board Layer:6L Material: FR4 TG170, purple soldermask Thickness:1.6mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.25mm Surfa... | |
| 16-layer Blackplane Boards Prototyping, small series and big batch supplier | 16-layer Blackplane Boards Layer:16L Material: FR4 TG180 Thickness:2.5mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.3mm Surface Finish: ENIG F... |
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