PHONEFIX hand-polished integrated blade PCB IC removal tool
产品描述
PHONEFIX 手工抛光一体式刀片采用一体式手柄设计,耐300℃高温手柄,使用方便,经久耐用。手工抛光,轻松撬出IC硬盘CPU脱层。5种形态,5种选择,全面覆盖各种维修场景。适用于撬硬盘、除胶、刮胶、撬CPU边缘胶等操作。
特点:
1. 耐300℃高温手柄支撑,使用方便,经久耐用。在手机维修过程中,刀片通常与热风枪配合使用,可承受高达300℃的高温。
2. 手工抛光,轻松撬出IC硬盘CPU脱层。精心手工抛光,无毛刺、无齿痕,轻松拾取精密元器件,不易损坏。
3. 5 种形态,5 种选择,全面覆盖各种维修场景。型号:01 撬开 iC CPU 去除胶水;型号:02 刮开 iC 边缘的粘合剂;型号:03 异形橡胶切割刀;型号:04 撬开 CPU 并分层;型号:05 撬出 iC 硬盘。
4. 一体式手柄设计,无需手柄,收到即可使用。
产品参数:
名称:手工抛光一体式刀片
产品型号:FX-08
包装尺寸:185x100x8mm
产品总重:45 克
单个重量:6 克
刀片型号:01、02、03、04、05
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