Multilayer PCBs Manufacturer
Key Specifications/Special Features:
Bare PCB capability:
Base materials: FR-4, high TG FR-4, lead-free, halogen free 94HB/FR-1/CEM-1, tg 170
Surface treatment: immersion gold
Minimum line width/space 0.12/0.11mm
Finished copper thickness: 35μm
Board thickness: 1.6mm
Layers: 1 to 8
Finished inner/outer copper thickness: 1 to 6oz
Finished board thickness: 0.2 to 7.0mm
Tolerance board thickness ≤1.0mm: ±0.1mm
1 < board thickness≤ 2.0mm: ±10%
Board thickness > 2.0mm: ±8%
Maximum panel size ≤ 2 sides PCB: 600x1500mm
Multilayer PCB: 500x1200mm
Minimum conductor line width/spacing:
Inner layers: ≥ 3/3mil
Outer layers: ≥ 3.5/3.5mil
Minimum hole size mechanical hole: 0.15mm
Laser hole: 0.1mm
Drilling precision:
First drilling: 1mil
Second drilling: 4mil
Warpage board thickness≤ 0.79mm: β ≤ 1.0%
0.80≤ Board thickness≤ 2.4mm: β ≤ 0.7%
Board thickness ≥ 2.5mm: β ≤ 0.5%
Controlled impedance: ±5%
Aspect ratio: 15 to 1
Minimum welding ring: 4mil
Minimum solder mask bridge: ≥0.08mm
Plugging vias capability: 0.2 to 0.8mm
Hole tolerance PTH: ±3mil
NPTH: ±2mil
Outline profile rout/ v-cut/bridge/stamp hole
Surface treatment OSP: 0.5 to 0.5μm
RoHS Directive-compliant
Bare PCB delivery time:
Layer prototype mass production (above 30(square)
1L quick sample: 12 hours
Usual time: 1 to 2 and 5 to 7 days
2L quick sample: 24 hours
Usual time: 3 to 4 to 7 to 9 days
4L quick sample: 48 hours
Usual time: 5 to 7 to 9 to 10 days
6L quick sample: 72 hours
Usual time: 6 to 8 to 10 to 12 days
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Multilayer PCBs Manufacturer | Key Specifications/Special Features: Bare PCB capability: Base materials: FR-4, high TG FR-4, lead-free, halogen free 94HB/FR-1/CEM-1, tg 170 Su... |
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