High Quality HDI PCB
Flexible-Rigid PCB
8 Layer HDI PCB
|
Layer Count/Technology |
4-20 layers |
4-20layers |
|
PCB Thickness Range |
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|
Build Up Technology |
1-N-1 / 2-N-2 / 3-N-3 / 4-N-4 |
1-N-1 / 2-N-2 / 3-N-3 / 4-N-4 / 5-N-5 / 6-N-6 / 7-N-7 |
|
110μm |
75μm |
|
|
Laser Techlology |
CO2 Direct Drilling（UV/CO2) |
CO2 Direct Drilling（UV/CO2) |
|
Materials |
FR4/FR4 Halogen Reduced |
FR4 / Taconic / Rogers / Others on request |
|
Class Transition Temperature |
140℃/ 150℃/ 170℃ |
140℃/ 150℃/ 170℃/ 200℃ |
|
Standard Glass Cloth |
1027/106 / 1080/2116 / 1501/7628 |
1037/106 / 1080/2116 / 1501/7628 / 1027/ |
|
Copper Thickness |
12μm/18μm/35μm/70μm |
9μm/12μm/18μm/35μm/70μm/105μm |
|
Copper Plating Holes |
20μm（25μm） |
13μm / 20μm / 25μm |
|
60μm / 60μm |
40μm / 40μm |
|
|
Soldermask Registration |
70μm |
60μm |
|
+/-38μmPhoto-imageable） |
+/- 25μm（Photo-imageable） |
|
|
Soldermask Color |
Green / White / Black / Red / Blue |
Green /White / Black / Red / Blue |
|
575mm × 500mm |
575mm × 500mm |
|
|
Production Panel |
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|
125μm |
100μm |
|
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Smallest Drill |
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Smallest Routing Bit |
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Surfaces |
OSP/Immersion Tin |
OSP/Immersion Tin |
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Immersion NI/AU |
Immersion NI/AU |
|
|
Plated Ni/AU |
Plated Ni/AU |
|
|
immersion AG |
immersion AG |
|
|
Scoring |
Yes |
Yes |
|
ID Print |
White |
White |
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