Controlled Impedance 6L/1.6mm HDI PCB in Mobile with blind and buried holes
Application Field: Mobile
Layer/Board Thickness:6L/1.6mm
Surface Treatment: ENIG+OSP
Line/Space: 3.5/3.5mil
Smallest Hole Diameter:0.15mm
Technical Feature: 1+4+1， impedance control blind and buried holes
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