ENIG BGA PCB
is a surface mount package for integrated circuits. BGAs can provide more interconnect pins than dual in-line or flat packs, each with solder balls. All connections are distributed in a uniform surface grid or matrix on the component.
BGA is a surface mount package for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. BGAs can provide more interconnect pins than dual in-line or flat packs, each with solder balls. All connections are distributed in a uniform surface grid or matrix on the component. The entire underside of the device can be used, not just the perimeter.
On average, the leads are also shorter than peripheral-only types, resulting in better performance at high speeds.
BGA is not like ordinary PCB. They require the latest manufacturing, assembly and testing techniques. We have the perfect solution for all your BGA PCB needs. We are technically well equipped to supply any complex or simple BGA PCB or PCBA.
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Application area: Consumer electronics |
Product feature: BGA/Black ink |
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Layer: 4 |
Surface treatment: ENIG |
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Material: FR4 |
Line width/Line space: 0.99/0.14mm |
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Thickness: 1.2mm |
Min hole φ: 0.20mm |
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