Pure tin 99.9% lead solder balls for computer chips reballing
Specical for bga,lead soldering balls 0.25-0.76mm,25W grain one bottle
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Pure tin 99.9% lead solder balls for computer chips reballing |
Specical for bga,lead soldering balls 0.25-0.76mm,25W grain one bottle |
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High temperature resistance film silicone tape for bga chips welding |
flame retardant,high temperature resistance,made of polyester silicone,tube rack adhesive tape,for bga soldering |
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BGA reballing tools solder wick desoldering wire for chips cleaning |
100% Japan original goot wick,width 3mm,length 1.5mm,was used for cleaning the removal tin on BGA |
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