Pure tin 99.9% lead solder balls for computer chips reballing
Specical for bga,lead soldering balls 0.25-0.76mm,25W grain one bottle
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Pure tin 99.9% lead solder balls for computer chips reballing | Specical for bga,lead soldering balls 0.25-0.76mm,25W grain one bottle |
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China good price SV560A full automatic mobile phone repairing machine with high quatily | Optical alignment SV560A BGA rework station,bottom preheating zone is IR wave gilding heter plate,with high temperature glass,temperature increasin... |
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BGA reballing tools solder wick desoldering wire for chips cleaning | 100% Japan original goot wick,width 3mm,length 1.5mm,was used for cleaning the removal tin on BGA |
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