High-Precision Material Thermal Conductivity Tester (Guarded Hot Plate Heat Flow Meter Method)

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High-Precision Material Thermal Conductivity Tester (Guarded Hot Plate Heat Flow Meter Method) is a fully automated thermal property testing system designed for accurate measurement of thermal conductivity and thermal resistance using the internationally recognized heat flow meter principle. The instrument applies a stable controlled temperature to one side of the specimen, allowing heat to transfer through the material to a cooled surface, while the transmitted heat flux is precisely measured to calculate thermal conductivity and thermal resistance. Equipped with imported sensors and computer-based control and data processing, the system delivers high accuracy, strong reliability, and excellent repeatability, especially for low thermal conductivity materials.

Application

TheHigh-Precision Material Thermal Conductivity Tester is suitable for steady-state thermal performance evaluation of materials with low to medium thermal conductivity, including:

Thermal insulation materials

Plastics and polymer-based materials

Rubber and elastomer materials

Aerogel panels and advanced insulation boards

Vacuum glass and building energy-saving materials

Solid materials and powder materials (with appropriate sample configuration)

The instrument is widely used in universities, research institutes, quality inspection laboratories, and industrial material testing facilities for thermal conductivity and thermal resistance analysis.

Standards

The instrument is designed and operated in accordance with the following international and national standards:

GB/T 10295-2008

Thermal insulation — Determination of steady-state thermal resistance and related properties — Heat flow meter method

ASTM E1530

Standard Test Method for Evaluating the Resistance to Thermal Transmission of Materials by the Guarded Heat Flow Meter Technique

ASTM C518-04

Standard Test Method for Steady-State Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus

Parameters

Item	Specification
Thermal conductivity range (low range)	0.0001 – 1 W/m·K (resolution up to 0.1 mW/m·K)
Thermal conductivity range (extended)	0.001 – 300 W/m·K
Measurement accuracy	±1%
Sample size	50 × 50 to 300 × 300 mm
Maximum sample thickness	≤ 50 mm
Optional sample sizes	600 × 600 mm, 800 × 600 mm (customized)
Applicable sample form	Solid materials, powder materials
Test duration	15 – 20 min
Hot plate temperature range	Room temperature to 99.9 °C (standard)
Optional hot plate range	Room temperature to 499.9 °C or higher (by agreement)
Hot plate control accuracy	0.1 °C
Cold plate temperature range	0 – 99.9 °C (standard); –10 – 99.9 °C optional
Cold plate temperature control	Water-cooled, precision constant-temperature bath
Cold plate control accuracy	0.1 °C
Pressure range	0 – 1000 N
Pressure resolution	0.1 N
Thickness measurement range	0 – 50 mm
Thickness resolution	0.1 μm
Heat flow sensor	Imported original heat flow meter
Test operation	Fully automatic computer-controlled testing and data storage
Power supply	AC 220 V / 50 Hz

Features

Guarded hot plate heat flow meter method for steady-state thermal measurement

High sensitivity for low thermal conductivity materials, resolution down to 0.1 mW/m·K

Imported heat flow sensors ensuring stable and reliable performance

Computer-controlled temperature regulation and pressure loading

Automatic thickness measurement with high resolution

Excellent accuracy, repeatability, and long-term measurement stability

Automatic data acquisition, analysis, storage, and report generation

Suitable for both solid and powder materials

Accessories

Main testing unit

Thermal analysis software (Chinese and English versions)

HX-1005 precision low-temperature constant-temperature water bath (0.01 °C accuracy)

Computer (user-selectable)

Calibration reference sample

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