Digital hot adhesion tensile apparatus

Whats/App: +86 156 1874 6768

Web: standard-groups.com

Standards

GB/T 34445-2017:Safety requirements for baby walkers straps

ASTM F2029:Standard Specification for Guidewires for Medical Applications

Features

1. Four testing functions—heat tack, heat seal, peel, and tensile strength—provide users with more combinations of testing conditions.

2. Digital P.I.D temperature control technology not only quickly reaches the set temperature but also effectively avoids temperature fluctuations.

3. Four force ranges and six testing speeds meet diverse user testing needs. The system is equipped with automatic zeroing, fault indication, overload protection, and travel protection to ensure user safety.

4. Manual and foot pedal start modes, along with a burn-proof safety design, effectively ensure user convenience and safety.

5. Microcomputer control, LCD display, PVC operation panel, and menu-driven interface facilitate quick operation and data viewing.

6. RS232 data transmission interface allows for easy import and export of test data. Supports the Lystem™ laboratory data sharing system for unified management of test results and reports.

Technical Parameters

Technical Parameter	Specification
Heat-Sealing Pressure	Adjustable from 0.05 MPa to 0.7 MPa, used to simulate different heat-sealing conditions.
Heat-Sealing Time	Adjustable from 0.1s to 999.9s, ensuring that the heat-sealing process reaches a stable state.
Hot-Tack Time	Adjustable from 0.1s to 999.9s, used to evaluate the performance of materials during the hot-tacking process.
Temperature Control	Using digital P.I.D temperature-control technology, it can quickly reach the preset temperature and maintain the temperature stable.
Force Range	Multiple ranges are available, such as 0 - 200N (some devices may have a larger range).
Accuracy	Generally level 1 or higher, ensuring the accuracy of measurement results.

Accessoriess

Standard Configuration: Main unit, pneumatic clamp, foot switch, Φ6 mm polyurethane hose (2m)

Optional Accessories: Professional software, communication cable, extended polyurethane hose, air compressor.

Note: The compressed air source interface of this machine is a Φ6 mm polyurethane hose; the air source and air source adapter are to be provided by the user; if the software is purchased separately, the computer is to be provided by the user.

Test Procedures

1.Device Preparation

Check the integrity of components (heat-sealing module, tensile sensor, clamps) and connect the power supply (110-240VAC, 50-60Hz).

Power on the device, activate the digital P.I.D temperature control system, and preheat to the preset temperature (wait for temperature stability).

2.Sample Preparation

Cut the packaging material (e.g., plastic film, composite packaging material) into standard-sized specimens (ensure surface is clean, free of impurities or damage).

3.Parameter Setting

Operate the 160×128 dot graphic LCD (with alphanumeric keypad) to set test parameters:

Heat-sealing pressure: 0.05–0.7MPa (adjust per material type).

Heat-sealing time: 0.1–999.9s (match production line conditions).

Hot-tack time: 0.1–999.9s (for hot-tack performance evaluation).

Force range: Select appropriate range (e.g., 0–200N) based on material stiffness.

4.Sample Installation

Fix the prepared specimen in the heat-sealing clamp (ensure alignment to avoid offset) and secure the other end in the tensile test clamp.

5.Test Execution

Start the heat-sealing process: The device completes heat-sealing under the set pressure/time/temperature.

Trigger the hot-tack tensile test: The instrument automatically applies tensile force to the freshly sealed specimen and records real-time data (e.g., hot-tack strength, heat-seal integrity).

6.Data Acquisition & Analysis

The built-in data system automatically collects test data, generates force-time curves, and calculates key indicators (e.g., heat-seal strength, hot-tack force).

7.Post-Test Operation

Remove the tested specimen, clean the clamps/heat-sealing module to avoid residue buildup.

Save the test report (including parameters, curves, and results) via the device interface.

Power off the device after cooling.

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