Multifunctional Rapid Thermal Conductivity Tester (TPS & Hot Disk Method)
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Whats/App: +86 185 0176 3615
Web: qinsun-lab.com
Multifunctional Rapid Thermal Conductivity Tester (Integrated Unit) is a high-precision instrument based on the Transient Plane Source (TPS) method, utilizing a Hot Disk probe. It measures thermal conductivity, thermal diffusivity, specific heat, heat storage coefficient, and thermal resistance of solid, powder, liquid, paste, coating, thin-film, insulation, and anisotropic materials.
The instrument provides rapid and accurate testing, avoiding contact resistance errors inherent in steady-state methods. Minimal sample preparation is required; solid materials only need a relatively flat surface. The tester supports various test protocols and mathematical models for different material types, offering broad applicability, fast testing, and reliable results.
Reference standards: ISO 22007-2:2015. GB/T 32064-2015.
Application
The tester is widely used for thermal characterization of:
Metals, alloys, and graphite
Thermal pastes, silicone, and rubber
Ceramics and composite ceramic materials
Polymers, paper, fabrics, foams, and insulation materials
Concrete, composite panels, and paper honeycomb structures
Anisotropic materials
Typical applications include:
Rapid thermal property testing in R&D and quality control laboratories
Characterization of high and low conductivity materials
Evaluation of thermal behavior in powders, pastes, liquids, coatings, and thin films
Thermal analysis of construction, aerospace, electronics, and insulation materials
Standards
ISO 22007-2:2015 – Determination of Thermal Conductivity and Thermal Diffusivity of Solids by Transient Plane Source (TPS) Technique
GB/T 32064-2015 – Thermal Conductivity Test Method Using Transient Plane Source (TPS) Technique
Parameters
| Item | Specification |
|---|---|
| Thermal conductivity range | 0.001–500 W/(m·K); resolution 0.0001 W/(m·K) |
| Thermal diffusivity range | 0.1–100 mm²/s |
| Heat storage coefficient | 0.1–30 W/(m²·K) |
| Specific heat | 0.1–5 kJ/(kg·°C) |
| Thermal resistance | 0.5–0.000005 mm²·K/W |
| Temperature measurement accuracy | ≤0.0001 °C |
| Measurement relative error | ≤3% |
| Repeatability error | ≤3% |
| Test duration | 1–120 seconds |
| Sample environment temperature | -40–150 °C (standard); optional -50–250 °C, vacuum environment available |
| Probe diameter | Standard Φ15 mm; optional Φ30 mm, Φ15 mm, Φ7.5 mm, Φ4 mm |
| Sample types | Solid blocks, powders, pastes, liquids, coatings, thin films, insulation materials, anisotropic materials |
| Automation | Full software-controlled measurement, parameter analysis, and report output |
| Power supply | AC 220 V ±10%, 50/60 Hz; total power |
| Form factor | Integrated compact unit, desktop installation |
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