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Multifunctional Rapid Thermal Conductivity Tester (TPS & Hot Disk Method)

Get a quote:

Whats/App: +86 185 0176 3615

Web: qinsun-lab.com

Multifunctional Rapid Thermal Conductivity Tester (Integrated Unit) is a high-precision instrument based on the Transient Plane Source (TPS) method, utilizing a Hot Disk probe. It measures thermal conductivity, thermal diffusivity, specific heat, heat storage coefficient, and thermal resistance of solid, powder, liquid, paste, coating, thin-film, insulation, and anisotropic materials.

The instrument provides rapid and accurate testing, avoiding contact resistance errors inherent in steady-state methods. Minimal sample preparation is required; solid materials only need a relatively flat surface. The tester supports various test protocols and mathematical models for different material types, offering broad applicability, fast testing, and reliable results.

Reference standards: ISO 22007-2:2015. GB/T 32064-2015.

Application

The tester is widely used for thermal characterization of:

Metals, alloys, and graphite

Thermal pastes, silicone, and rubber

Ceramics and composite ceramic materials

Polymers, paper, fabrics, foams, and insulation materials

Concrete, composite panels, and paper honeycomb structures

Anisotropic materials

Typical applications include:

Rapid thermal property testing in R&D and quality control laboratories

Characterization of high and low conductivity materials

Evaluation of thermal behavior in powders, pastes, liquids, coatings, and thin films

Thermal analysis of construction, aerospace, electronics, and insulation materials

Standards

ISO 22007-2:2015 – Determination of Thermal Conductivity and Thermal Diffusivity of Solids by Transient Plane Source (TPS) Technique

GB/T 32064-2015 – Thermal Conductivity Test Method Using Transient Plane Source (TPS) Technique

Parameters

ItemSpecification
Thermal conductivity range 0.001–500 W/(m·K); resolution 0.0001 W/(m·K)
Thermal diffusivity range 0.1–100 mm²/s
Heat storage coefficient 0.1–30 W/(m²·K)
Specific heat 0.1–5 kJ/(kg·°C)
Thermal resistance 0.5–0.000005 mm²·K/W
Temperature measurement accuracy ≤0.0001 °C
Measurement relative error ≤3%
Repeatability error ≤3%
Test duration 1–120 seconds
Sample environment temperature -40–150 °C (standard); optional -50–250 °C, vacuum environment available
Probe diameter Standard Φ15 mm; optional Φ30 mm, Φ15 mm, Φ7.5 mm, Φ4 mm
Sample types Solid blocks, powders, pastes, liquids, coatings, thin films, insulation materials, anisotropic materials
Automation Full software-controlled measurement, parameter analysis, and report output
Power supply AC 220 V ±10%, 50/60 Hz; total power
Form factor Integrated compact unit, desktop installation

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