900M-T-iC18 mini all-copper CPU degumming station, suitable for T12 C210 936 soldering iron
Description
900M-T-iC18 Mini Copper CPU Glue Removal Station with chip positioning heating glue removal desoldering 3-in-1 functions and compatible with T12 C210 936 Soldering Iron for Mobile/iPhone A9-A18 CPU glue removal and mini IC FPC components heating soldering and desoldering repair. 900M-T-iC18 copper small ironing board effectively solves the problems of disassembly and assembly of iPhone Face ID cable and FPC connector cable and chip glue removal.
Features:
1. 900M-T-iC18 Mini Copper Soldering Heating Station with CPU positioning debonding slot supports Apple iPhone A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 CPU glue removal.
2. Small ironing board with a wide disassembly range, can solve the problems of disassembly and assembly of iPhone Face ID cable and inline connector flex cable and chip glue removal.
3. Suitable for Mobile iPhone CPU chip positioning, heating, degumming, and desoldering, etc.
4. 3 in 1 multi-series, suitable for 936 C210 and T12 soldering iron tips and other desoldering stations.
5. 5S rapid heating, positioning, debonding, and tin planting.
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