.

Back grinding wheels for thinning

back grinding Wheel for inserts

Siliconwafer back grinding wheelsare mainly used for the thinning and fine grinding of the silicon wafer.

Coolant: Oil, emulsion

workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin,ATM, Melchiorre, Peter Wolters, Diskus, Viotto, Wendt

Material of workpiece: monocrystalline silicon and some other semiconductor materials.

Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM

Main role of back grinding wheel

In the middle of the pre-production process, thick silicon wafer can reduce damage; before assembly, silicon wafer is thinned, which is conducive to heat dissipation; reduce package volume; improve mechanical strength (softer after thinning, softer after thinning, minus Small stress); improve electrical performance (short connection); reduce the workload of dicing wafer

Vitrified bond suitable for silicon wafer back grinding wheel

Vitrified bond diamond grinding wheel bond agent has higher strength; good wear resistance, sharp cutting Grinding efficiency is high, and easy to trim; generally suitable for silicon wafers, such as rough grinding, semi-finishing grinding, etc.

The diamond grinding wheel has good self-sharpening performance and is not easy to clog; the grinding efficiency is high, the grinding force is small, and the grinding temperature is low The bonding agent itself has good elasticity and polishing performance; the workpiece has high surface finish and good surface quality; it is suitable for fine grinding and polishing of silicon wafers.

The Specification Of Diamond Back Grinding Wheels:

Model

Diameter (Mm)

Thickness (Mm)

Hole (Mm)

6A2

175

30, 35

76

200

35

76

350

45

127

6A2T

195

170

280

30

6A2T(Three Ellipses)

350

35

235

209

158

Other Size Can Ba Made According To Customers Requirements

silicon wafer back grinding wheel features:

1, surface quality: require grinding lines evenly, without chipping, debris, scribe, etc.;

2, processing accuracy: TTV <5 μm etc. (Total thinning veracity);

3, processing quality: surface roughness: < 10 nm; damage layer thickness: < 10 μm;

Applicationof back grinding wheel

The grinding wheels for LED substrateare mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.

The LED substrate thinning grinding wheel is mainly used for the back surface thinning of the sapphire epitaxial wafer, silicon wafer, gallium arsenide and gallium nitride wafer in the LED industry. The grinding LED substrate grinding wheel developed by our company has superior grinding performance and high cost performance. It can be used stably in European, American, Japanese and domestic grinding machines, and can replace imported products.

If you need any products, do not hesitate to contact



Send product request

To: More Super Hard Products Co., Ltd
Your E-mail:
Message text:


Send to other suppliers

Other supplier products

Diamond Bruting Wheel
Diamond Bruting Wheel Description of Diamond Bruting Wheel: Vitrified Diamond bruting wheel is popular used in natural diamond bruting, grinding and polishing; it can al...
PDC Cutter
PDC Cutter PDC Cutter Petroleum & Geology Industry Type: More Types Payment Terms: T/T, Western Union, MoneyGram, PayPal Tel/ PDC Cutter...
Solid carbide circular saw blade for aluminum cutting
Solid carbide circular saw blade for aluminum cutting Solid carbide circular saw blade for aluminum cutting Specifications 1. Solid carbide saw2 .Factory: 17 years3. Steel plate: 75 Cr14 .Teeth:Cerat...
The Used PDC Cutter
The Used PDC Cutter PDC (Polycrystalline Diamond Compact) Cutter is kind of superhard material that compact polycrystalline diamond with tungsten carbide substrate at ...
CVD Synthetic Diamond Plates
CVD Synthetic Diamond Plates CVD Synthetic Diamond Plates CVD Diamond Is Used For Ultra Precision Cutting Tools (Such As CVD Indexable Inserts, CVD Bor...
All supplier products

Same products

AF38M Blue Abrasive Film
AF38M Blue Abrasive Film Seller: CHANGZHOU RMN ABRASIVES CO., LTD RMC AF38M blue abrasive film can be used as Velcro and PSA disc, and also suitable for different ...
AP36M Velcro Disc
AP36M Velcro Disc Seller: CHANGZHOU RMN ABRASIVES CO., LTD RMC AP36M abrasive velcro sandpaper discsimpregnated latex, flexible. Special super stearated coa...
AP36M PSA Sanding Discs
AP36M PSA Sanding Discs Seller: CHANGZHOU RMN ABRASIVES CO., LTD RMC AP36M abrasive paper PSA sanding discimpregnated latex, flexible. Special super stearated coa...
AP33M Velcro Backed Sandpaper
AP33M Velcro Backed Sandpaper Seller: CHANGZHOU RMN ABRASIVES CO., LTD RMC AP33M velcro sanding paperroll is a special sandpaper product suitable for fast sanding. Prem...
AP33M PSA Sanding Discs
AP33M PSA Sanding Discs Seller: CHANGZHOU RMN ABRASIVES CO., LTD RMC AP33M PSA sanding discis a special sand paper product suitable for fast sanding. Premium alum...