Back Grinding Wheels for Silicon Wafer Thinning
Surface quality: require grinding lines evenly, without chipping, debris, scribe, etc.;
Processing accuracy: TTV <5 um etc. (Total thinning veracity)
Processing quality: surface roughness: < 10 nm; damage layer thickness: < 10 um
PRODUCT DETAILS
Description:
Silicon grinding wheels are mainly used for trimming of silicon wafer. These products produced by our institute, which possess superior grinding performance and high cost performance, are among the top level worldwide.
Application:backthinning,grindingandfinegrindingofapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Applicable Grinding Machine:
The back grinding wheels can be used for the Japanese, German, American, Korean and other grinders. Such as Okamoto, Disco, Strasbaugh and others grinding machine
Advantages:
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