High-frequency Spindles For Wafer Dicing Or Silicon Plate Cutting
High-frequency spindles for cutting performanceZYS high-frequency spindles for wafer dicing use air static pressure bearings,Website:, and the wafer scriber spindles have high precision, low vibration, steady rotation and reliable performance.ParametersTypeSpeedr/minKWVoltageVCurrentAFrequeceHz92GD40Q400000.752202.666680GD30Q300000.51652.5500
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High-speed Sealed Angular Contact Ball Bearings |
ZYS High-speed sealed angular contact ball bearingsHigh-speed sealed angular contact ball bearings performanceWhen machine tool spindle runs under ... |
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Bearing With Shaft |
Bearing with ShaftThere are two types of bearings with shaft in our company: monolithic structures and semi-monolithic structures.The unit of monol... |
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CNC Internal Grinder For Bearing Ring |
1. ZYS bearing internal grinders is equipped with Japanese FANUC numerical control system and uses plasma touch screen dynamically displaying the g... |
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Bearing Bore Diameter Measuring Instrument |
Multi-parameter bearing bore diameter & outside diameter measuring instrument PerformanceThis instrument is designed according to the measuring met... |
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CNC Internal Grinder For Ball Bearing Ring |
Main feature1Equipped with Japanese MITSUBISHI control system,Website: grinder can dynamically display the grinding process by using plasma touch s... |
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