High-frequency Spindles For Wafer Dicing Or Silicon Plate Cutting
High-frequency spindles for cutting performanceZYS high-frequency spindles for wafer dicing use air static pressure bearings,Website:, and the wafer scriber spindles have high precision, low vibration, steady rotation and reliable performance.ParametersTypeSpeedr/minKWVoltageVCurrentAFrequeceHz92GD40Q400000.752202.666680GD30Q300000.51652.5500
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High-frequency grinding spindlesGrinding Spindle1. Tight structure,Website:, high mechanical effciency, low noise, low vibration, high precision.2.... |
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High-frequency spindles for special grinding performance
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Degaussing EquipmentReasonable design,Website:, convenient operation, ZYS Degaussing EquipmentIs used in bearing production process and finished pr... |
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