HIGH HEAT DISSIPATION MCPCB
Project Description
|Parameters
1 Layer
Thickness: 1.2+/-0.1 mm
Min Hole Size: 3.175 mm
Width/Space: 0.12mm/0.1 mm
Surface Treatment: OSP
|Craft
White Ink
3W Heat Dissipation Coefficient
|Application
LED Light
1 Layer
Thickness: 1.2+/-0.1 mm
Min Hole Size: 3.175 mm
Width/Space: 0.12mm/0.1 mm
Surface Treatment: OSP
|Craft
White Ink
3W Heat Dissipation Coefficient
|Application
LED Light
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HIGH HEAT DISSIPATION MCPCB | Project Description |Parameters1 LayerThickness: 1.2+/-0.1 mmMin Hole Size: 3.175 mmWidth/Space: 0.12mm/0.1 mmSurface Treatment: OSP|CraftWhite Ink... |
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