12-layer High Density Interconnector (HDI) Boards Exporter
12-layer High Density Interconnector boards Thickness:0.8mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.1mm Surface Finish: ENIG+OSP
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PCBs, 100% E-test, AOI inspection, Impedance Tests | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.3... |
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Rigid-flex Printed Circuit Boards(PCB) Manufacturer | Rigid-flex Printed Circuit Board Material: FR4+Polyimide |
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Printed Circuit Board (pcb) with Shengyi FR4 material | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.3... |
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PCBs with blind and buried vias | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.3... |
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FR4 (Normal Tg, Mid Tg, High Tg)+ Roger Multilayer Printed Circuit Boards(PCB) | Multilayer printed circuit boards Layer:2-30L Material: FR4 (TG130, TG150, TG170, TG180)+ Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.... |
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PCBs with blind and buried vias | Seller: Hui Hexun Industrial (HongKong) Co., Ltd. | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Wi... |
