PCBs with blind and buried vias
Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.30mm Surface Finish: HASL lead free/with lead Finish Copper: 17μm-280μm
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IPC Class 2 and 3 PCBs Fabrication Prototype | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.3... |
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Printed Circuit Board (pcb) with Shengyi FR4 material | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.3... |
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12-layer High Density Interconnector (HDI) Boards Exporter | 12-layer High Density Interconnector boards Thickness:0.8mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.1mm Surface Finish: ENIG+OSP |
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6L Printed Circuit Boards, Multilayer PCBs Prototype Fabrication | 6L Printed Circuit Board Layer:6L Material: FR4 TG170 Thickness:1.6mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.25mm Surface Finish: ENIG Fin... |
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4L Printed Circuit Board, yellow soldermask, Multilayer PCBs Prototyping & small series Supplier | 4L Printed Circuit Board, yellow soldermask Layer:4L Material: FR4 Thickness:1.6mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.25mm Surface Fin... |
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PCBs with blind and buried vias | Seller: Hui Hexun Industrial (HongKong) Co., Ltd. | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Wi... |
