Dicing Blades With Hub
Disco Dicing Blade
Our Disco diamond bladewith Hub is with a stronger edge, which makes the blade more rigid and keeps the edge not to be broken, so the cutting with the blade is in high efficiency and of excellent quality. This wheel is mainly used for the cutting and dicing wafers of silicon, GaAs, gap, pzt, etc.
Egrind, as an excellent cbn grinding wheel suppliers, offers a wide range of metal bond diamond wheelfor you to choose from.
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| Dicing Blades With Hub | Our disco diamond blade with Hub is with a stronger edge, which makes the blade more rigid and keeps the edge not to be broken, so the cutting with... | |
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| Dicing Blades Without Hub | The wafer dicing bladewithout hub is a kind of ultra-thin and precision diamond dicing bladeswith excellent cutting ability, good rigidity, and hig... | |
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