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Dicing Blades Without Hub

The wafer dicing bladewithout hub is a kind of ultra-thin and precision diamond dicing bladeswith excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ceramics, etc.

Performance of Dicing BladesWithout Hub

Strong cutting ability

High accuracy

The thinnest wheel is 0.015mm, thickness tolerance is ±0.002mm

Applications of ultra thin diamond bladeWithout Hub

For dicing BGA, Alumina, TiC, Ferrite, LTCC, and other materials.

E grind, as an excellent diamond wheel manufacturer, offers a wide range of resin bonded grinding wheelsfor you to choose from.


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