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PCB assembly OEM

Capabilities Manufacturing Services: Complete product assembly (Box Build) Procurement: Turnkey and Consignment Board Assembly: Surface Mount, Through Hole, Auto Insertion and Manual Insertion. Assembly Capabilities: Ball Grid Array (BGA), Multi-Chip Module (MCM), Flip Chip, Chip-on-Board (COB) ,Tape Automated Bonding (TAB), Wire Bonding and Mil-spec. Chip Size Placement: 1608, 1005, 0603, 0402 and 0201 Printed Circuit Board Size Capabilities: Smallest PCB dimension at 2" by 2" and largest PCB dimension at 15" by 20". Cleaning Capabilities: Aqueous, No-Clean and Alternate Solvent. Test Capabilities: In Circuit, Functional, Burn-In, Automatic Test Equipment (ATE) Design and X-ray.



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