Copper Target
Copper targetis a high-purity and highly conductive material utilized in various applications such as semiconductor production, solar cell manufacturing, and research applications such as X-ray fluorescence analysis. The copper targets are available in various shapes and sizes and are designed with high precision to meet the industry standards. The copper targets feature exceptional durability, excellent thermal conductivity, and resistance to corrosion and oxidation, making them a reliable material.
Classification Of Copper Target
Copper targets are classified based on the manufacturing process, purity level, and the shape and size of the final product. Based on the manufacturing process, the copper targets are divided into two categories - sputtering targets and electroplating targets. Sputtering targets are manufactured using high-temperature techniques, whereas electroplating targets are made through electrochemical processes.
Purity level also plays a significant role in copper target classification, with high-purity copper targets typically featuring purity levels greater than 99.99%. Depending on the shape and size requirement, copper targets can be classified into various shapes such as plates, disks, squares, and rectangles, or custom shapes as per the specific application needs.
Operating Principle of Copper Target
Copper targets are primarily used in sputtering and electroplating applications, where high-purity copper films are required. In the sputtering process, a high-energy ion beam hits the surface of the copper target, causing it to eject copper atoms. These atoms then deposit onto a substrate, forming a thin film.
The sputtering process operates based on the ionization of the sputtering gas, typically argon, which creates a plasma that is accelerated towards the target surface. The plasma ionizes the gaseous argon, creating high-energy ions that impact the copper target, causing sputtering. The sputtered material is deposited onto a substrate, creating a uniform and high-purity copper film.
In the electroplating process, a copper target is used as the anode, and a substrate is used as the cathode. Direct current is passed through a copper sulfate solution to deposit copper onto the substrate. During this process, copper ions dissolve off the target, migrate to the cathode, and deposit onto the substrate, forming a thin copper film.
Overall, the efficient operation of both sputtering and electroplating processes is highly dependent on the purity and quality of the copper target material.
Physical Properties Of Copper Target
|
Density |
|
|
Color |
Purplish red |
|
Melting point |
|
|
Boiling point |
2567℃ |
The copper target is appropriate for various sputtering techniques, such as two-pole sputtering, three-pole sputtering, four-pole sputtering, RF sputtering, ion beam sputtering, magnetron sputtering, and facing targets sputtering. It is suitable for the deposition of several types of films, such as reflective, conductive, semiconductor, decorative, protective, and integrated circuit films, commonly used in applications including displays.
Compared to other target materials, copper targets are cost-effective, making them the preferred choice when the desired film functionalities can be achieved.
If you want to know more about copper target price, please contact us.
More applications of cooling system in industry, please visit our website.
Отправить запрос, связаться с поставщиком
Другие товары поставщика
 |
Molybdenum Sheet | Molybdenum sheetis a thin, flat piece of metal made from molybdenum. It is known for its high melting point, resistance to corrosion and wear under... |
 |
Di (2-ethylhexyl) Phosphate (P204) | Di 2 ethylhexyl phosphate(P204), also known as bis(2-ethylhexyl) phosphate, is an organophosphorus compound with the chemical formula C16H35O4P. It... |
 |
Molybdenum Wire | Molybdenum wireis a thin, high-strength wire made from molybdenum metal. It is known for its excellent thermal and electrical conductivity, high me... |
 |
Pressure Vessel | Pressure Vessel Pressure vessels can be categorized into refrigeration and chemical pressure vessel. A refrigeration pressure vessel usually compr... |
 |
SPUTTERING TARGET BONDING | SPUTTERING TARGET BONDING Sputtering target bondingis a process that involves attaching a sputtering target to a backing plate or a substrate hold... |
Похожие товары
 |
Liebert CRV+ Cooling water air conditioning between trains | Продавец: Hebei Kelingyizhi Communication Technology Co., Ltd | The Liebert CRV+series unitis a high-end air conditioner used for inter train and cabinet level c... |
 |
Идеальная замена прокладки пластинчатого теплообменника SONDEX S04A | Продавец: New Roc Industrial Limited | |
 |
HaiPick System Boosts Micro-fulfillment Centers in Europe for Faster Online Orders | Продавец: HAI ROBOTICS | The fastest and most efficient way to fulfill online orders has become a top supply chain priorit... |
 |
50mm DC Axial Cooling Fan | Продавец: Shenzhen Xiehengda Electronics Co.,Ltd. | 50mm DC axial cooling fans are a type of fan with a 50mm diameter, which makes them ideal for sma... |
 |
40mm DC Axial Cooling Fan | Продавец: Shenzhen Xiehengda Electronics Co.,Ltd. | 40mm DC axial cooling fans are a type of fan with a 40mm diameter that are commonly used in elect... |
